HCL 30 相干DFB激光器芯片

适用于数据中心太比特光互联、AI算力集群等光模块

Commodity name： HCL 30 相干DFB激光器芯片

类别：

激光器芯片

电子邮件：

info@hiefo.com，marketing@hiefo.com

产品参数表

Related Products

产品详情

产品介绍
- HCL30是一款专为相干光模块设计的窄线宽DFB激光器芯片，基于高效低噪声架构，实现行业领先的超窄线宽与高输出光功率。
产品应用
- ■ 用于数据中心DCI以及AI训练集群相关的太比特级相干光模块
产品特点
- ■ 线宽<300kHz
- ■ 输出功率21dBm
- ■ O波段与C波段双波长覆盖
- ■ 符合Telcordia Technologies™ GR-468-CORE可靠性标准
- ■ 符合RoHS规范（无铅化工艺）

Keyword:

产品参数表

请填写此表格以获取产品参数表，我们的专业团队将主动与您联系。

产品：

立即提交

COOKIES

我们的网站使用 cookie 和类似技术来个性化向您展示的广告，并帮助您在我们的网站上获得最佳体验。有关更多信息，请参阅我们的隐私和Cookie政策

COOKIES

Our website uses cookies and similar technologies to personalize the advertising shown to you and to help you get the best experience on our website. For more information, see our Privacy & Cookie Policy

required

These cookies are necessary for basic functions such as payment. Standard cookies cannot be turned off and do not store any of your information.

analyze

These cookies collect information, such as how many people are using our site or which pages are popular, to help us improve the customer experience. Turning these cookies off will mean we can't collect information to improve your experience.

Feature

These cookies enable the website to provide enhanced functionality and personalization. They may be set by us or by third-party providers whose services we have added to our pages. If you do not allow these cookies, some or all of these services may not function properly.

advertise

These cookies help us understand what you are interested in so that we can show you relevant advertising on other websites. Turning these cookies off will mean we are unable to show you any personalized advertising.

info@hiefo.com，marketing@hiefo.com

完成您的工作申请

感谢您有兴趣加入我们的团队！我们很高兴能更多地了解您。

附上您的求职信/简历

请上传 pdf. 格式的文件和doc.格式

提交

HCL 30 相干DFB激光器芯片

产品介绍

产品应用

产品特点

COOKIES

COOKIES